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VLSI packaging
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Hardware
Very large scale integration design
VLSI packaging
Term
Metadata
VLSI packaging
Alternative terms
UF
↸
very large scale integration packaging
UF
↸
very large-scale integration packaging
UF
↸
very-large scale integration packaging
UF
↸
very-large-scale integration packaging
Broader Terms
BT
↑
Very large scale integration design
More specific terms
NT3
↓
Die and wafer stacking
NT3
↓
Input / output styles
NT3
↓
Multi-chip modules
NT3
↓
Package-level interconnect
Date of creation
22-Jan-2018
Accepted term
22-Jan-2018
Descendant terms
4
ARK
ark:/99152/t3j17zjoo43oln
More specific terms
4
Alternative terms
4
Related terms
0
Notes
0
Metadata
BS8723-5
DC
MADS
SKOS-Core
VDEX
XTM
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